HDI PCB Boards Sucessful Cases Show-DefinitionHDI PCB is defined as
a printed circuit board with a higher wiring density per unit area
than a conventional PCB. They have much finer lines and spaces,
smaller vias and capture pads, and higher connection pad density
than employed in conventional PCB technology. HDI PCBs are made
through microvias, buried vias and sequential lamination with
insulation materials and conductor wiring for higher density of
routing.-ApplicationsHDI PCB is used to reduce size and weight, as
well as to enhance electrical performance of the device. HDI PCB is
the best alternative to high layer-count and expensive standard
laminate or sequentially laminated boards. HDI incorporate blind
and buried vias that help to save PCB real estate by allowing
features and lines to be designed above or below them without
making a connection. Many of today's fine pitch BGA and flip-chip
component footprints do not allow for running traces between the
BGA pads. Blind and buried vias will only connect layers requiring
connections in that area.PCB CapabilitiesRigid PCB Manufacturing
Capacity ABIS experienced in making special materials for
rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu
Base, etc. Below is a brief overview
FYI. ItemSpeci.Layers1~20Board
Thickness0.1mm-8.0mmMaterialFR-4, CEM-1/CEM-3, PI, High Tg, Rogers,
PTEF, Alu/Cu Base, etcMax Panel Size600mm×1200mmMin Hole
Size0.1mmMin Line Width/Space3mil(0.075mm)Board Outline
Tolerance+_0.10mmInsulation Layer Thickness0.075mm--5.00mmOut Layer
Copper Thickness18um--350umDrilling Hole
(Mechanical)17um--175umFinish Hole
(Mechanical)0.10mm--6.30mmDiameter Tolerance
(Mechanical)0.05mmRegistration (Mechanical)0.075mmAspect
Ratio16:1Solder Mask TypeLPISMT Mini. Solder Mask Width0.075mmMini.
Solder Mask Clearance0.05mmPlug Hole
Diameter0.25mm--0.60mmImpedance Control Tolerance+_10%Surface
finishENIG, OSP, HASL, Chem. Tin/Sn, Flash
GoldSoldermaskGreen/Yellow/Black/White/Red/BlueSilkscreenRed/Yellow/Black/WhiteCertificateUL,
ISO 9001, ISO14001, IATF16949 Special RequestBlind hole, Gold
finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating,
Half holesMaterial SuppilersShengyi, ITEQ, Taiyo, etc.Common
PackageVacuum+Carton Lead TimePCB Lead Time CategoryQ/T
Lead timeStandard Lead TimeMass Production Double
Sided24hrs3-4 working days8-15 working days 4 Layers48hrs3-5
working days10-15 working days 6 Layers72hrs3-6 working
days10-15 working days 8 Layers96hrs3-7 working days14-18
working days 10 Layers120hrs3-8 working days14-18 working
days 12 Layers120hrs3-9 working days20-26 working days 14
Layers144hrs3-10 working days20-26 working days 16-20
LayersDepends on the specific requirements 20+ LayersDepends
on the specific requirementsOur AdvantagesHigh-end euipment-high
speed Pick and Place Machines that can process about 25,000 SMD
components per hourHigh efficient supply ability 60K Sqm
monthly-Offers low volume and on-demand PCB production, also
large-scale productionProfessional engineering team-40 engineers
and their own tooling house, strong at OEM. Offers two easy
options: Custom and Standard-In-depth knowledge of IPC Class II and
III StandardsWe provide a comprehensive turn-key EMS service to
customers who want us to assemble the PCB into PCBA, including
prototypes, NPI project, small and medium volume. We are also able
to source all components for your PCB assembly project. Our
engineers and sourcing team have rich experience in supply chain
and EMS industry, with deep knowledges in SMT assembly allowing to
resolve all the production issues. Our service is cost-effective,
flexible, and reliable. We have satisfied customers across many
industries including medical, industrial, automotive and consumer
electronics. Quality ControlQuality
Control-Advanced equipment listAOI TestingChecks for solder
pasteChecks for components down to 0201Checks for missing
components, offset, incorrect parts, polarityX-Ray InspectionX-Ray
provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale
packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is
commonly used in conjunction with AOI minimizing functional defects
caused by component problems.Power-up TestAdvanced Function
TestFlash Device ProgrammingFunctional testing IOC incoming
inspectionSPI solder paste inspectionOnline AOI inspectionSMT first
article inspectionExternal assessmentX-RAY-welding inspectionBGA
device reworkQA inspectionAnti-static warehousing and
shipment-Persue 0% complaint on qualityAll department implements
according to ISO and the related dept has to provide 8D report if
any board scrapped to defective.All the outgoing boards have to be
100% electronic tested, impedance tested and soldering.Visual
inspected, we make the inspect microsection before shipment.Train
the mindset of employees and our enterprise culture, make they
happy with their work and our company, it's helpful for them to
produce good quality products.High quality raw material (Shengyi F
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