PCB Bom PCB Board Assembly Fabrication Headphones PCB

Basic Info.Model NO.Rigid PCBTypeRigid Circuit BoardDielectric Fr-4 MaterialFiberglass EpoxyApplicationComputerFlame Retardant Properties V0 Mechanical RigidRigidProcessing Technology Electrolytic Foil Base Material Copper Insulation MaterialsEpoxy ResinTransport PackageVacuum PackingSpecification2L-32LOriginShenzhenProduct DescriptionCIRCUITS (Design for manufacturing capability)-RigidItemNamelimit capability(sample)limit capability(small-medium volume)1MaterialNormal FR-4Brand: KingBoard, ShengYi, ITEQBrand: KingBoard, ShengYi, ITEQ2Special materialNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, CeramicNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, Ceramic3TypeRigid PCBMulti-blind&Buried, thick copper, Via in Pad(copper filled, resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.Multi-blind&Buried, thick copper, Via in Pad(resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.4Lay upBlind&Buriedlamination≤3timeslamination≤2times5SurfaceFinishLead-freeLead-free with HASL,Electroplated gold(Substrate thickness≤2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIGLead-free with HASL,Electroplated gold(Substrate thickness≤1OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIG6LeadedLead with HASLLead with HASL7Plating/coatingthicknessHASL2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)8Electroplated goldNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM9ENIGNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM10Immersion Tin≥1.0UM≥1.0UM11Immersion Sliver0.1-0.3UM0.1-0.3UM12OSP0.2-0.3UM0.2-0.3UM13Hard Gold≤1.25UM≤1.25UM14ENEPIGNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UMNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UM15Carbon Ink0.1-0.35UM0.1-0.35UM16Soldermask15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness