Big Size Ceramic Base PCB Al2O3 Alumina Aluminum Oxide Substrate

Big Size Ceramic Base PCB Al2O3 Alumina Aluminum Oxide Substrate  Advantages of Ceramic Substrates Over Traditional PCB Boards1. The heat dissipation and insulation performance of the ceramic substrate is better.(1) The thermal conductivity of the ceramic substrate is between 25-230W/mk: the most commonly used are Al2O3 substrate: 25-30W/m·K, Si3N4 substrate: 80-95W/m·K, and AIN substrate: 150-230W/m·K. The traditional PCB board is made of glass fiber material, and the thermal conductivity is lower than 1.1W/m·K, far inferior to ceramic substrates.MaterialThermal Conductivity (W/m·K)FR40.8-1.1Alumina (Al2O3)25-30Silicon Nitride (Si3N4)80-95Aluminum Nitride (AIN)170-230(2) The volume resistivity of the ceramic substrate is more than 1014Ω·cm, and the insulation performance far exceeds that of the traditional PCB board.2. The CTE of the ceramic substrate is matched to that of the semiconductor silicon material, which helps minimize stress that can cause components and solder joints to crack.3. The ceramic substrate has high reliability and stable performance in extreme environments (such as high temperature, high humidity, high pressure, high corrosion, high radiation, high-frequency vibration, etc.), while the traditional PCB board cannot adapt to harsh environments, e.g. the glass transition temperature of the traditional PCB board is generally 170°C, and it will soften or deform if it exceeds this temperature.About the SizeThe size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm.Manufacturing Capacity1. Product SpecificationProducts of various specifications can be produced. The table below shows our standard thicknesses and sizes.Alumina Ceramic Substrate99.6% Al2O3Thickness (mm)Maximum Size (mm)ShapeMolding TechniqueAs FiredLappedPolishedRectangularSquareRound0.1-0.2 50.850.8 √√Tape Casting0.25 114.3114.3 √ Tape Casting0.38120114.3114.3 √ Tape Casting0.5120114.3114.3 √ Tape Casting0.635120114.3114.3 √ Tape CastingOther special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.96% Al2O3Thickness (mm)Maximum Size (mm)ShapeMolding TechniqueAs FiredLappedPolishedRectangularSquareRound0.25120114.3114.3 √ Tape Casting0.3120114.3114.3 √ Tape Casting0.38140×190  √  Tape Casting0.5140×190  √  Tape Casting0.635140×190  √  Tape Casting0.76130×140  √  Tape Casting0.8130×140  √  Tape Casting0.89130×140  √  Tape Casting1280×240  √  Tape Casting1.5165×210  √  Tape Casting2500×500   √ Tape CastingOther special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.   2. Material Properties Alumina Ceramic SubstrateItemUnit96% Al2O399.6% Al2O3Mechanical PropertiesColor//WhiteIvoryDensityDrainage Methodg/cm3≥3.70≥3.95Light Reflectivity400nm/1mm%9483Flexural StrengthThree Point BendingMPa>350>500Fracture ToughnessIndentation MethodMPa·m1/23.03.0Vickers HardnessLoad 4.9NGPa1416Young's ModulusStretching MethodGPa340300Water Absorption  %00Camber/Length‰T≤0.3: ≤5‰, Others: ≤3‰≤3‰Thermal PropertiesMax. Service Temperature (Non-loading)/ºC12001400CTE (Coefficient of Thermal Expansion)20-800ºC1×10-6/ºC7.87.9Thermal Conductivity25ºCW/m·K>24>29Thermal Shock Resistance800ºC≥10 TimesNo CrackNo CrackSpecific Heat25ºCJ/kg·k750780Electrical PropertiesDielectric Constant25ºC, 1MHz /9.49.8Dielectric Loss Angle25ºC, 1MHz ×10-4≤3≤2Volume Resistivity25ºCΩ·cm≥1014≥1014Dielectric StrengthDCKV/mm≥15≥15Production ProcessThe molding process used for our alumina ceramic substrates is tape casting. Product PackagingBecause ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.   /* January 22, 2024 19:08:37 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1