Company Profile(Recognized as a national hign-tech
enterprise)Welcome to Top 3
Supplier JingXin Electronic Focus on
PCB,PCBA Shenzhen Jingxin Electronic Technology Co.,Ltd. Built
since 2002, is a almost 20 years professional company dedicating to
PCB&PCBA industry.Our factory located in Shenzhen, and have
dust-free workshop which cover an area of over than 10000m², almost
550 employees, more than 30 production lines include
SMT,DIP,automatic welding,aging test and assembly. We have
equipments of over 50 SMT machines from Japan and Korea, automatic
solder paste printing machines, solder paste inspection
machine(SPI), 12 temperature zone reflow soldering machine, AOI
detector, X-RAY detector, wave soldering machine, EM PCB dispenser,
laser print machine etc., Different line configurations can meet
requirements from small sample order to bulk shipment.Our company
has obtained ISO 9001 quality system certification and ISO 14001
system certification. With multi-testing procedures, our products
carry out the quality system standard strictly. With end to end
one-stop manufacturing solution, the company has become a
benchmarking enterprise in the industry, and has been earning
industry praises and good reputation from domestic and
international customers depending on rigorous, techniques, good
quality, fast delivery and excellent service.Product
Description(One stop
Manufacturing)(Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI
test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging
ect) TermDetailed Specification of PCBA Board
ManufacturingLayer1-30 layerMaterialFR-4, CEM-1, CEM-3, Hight TG,
FR4 Halogen Free, FR-1, FR-2, AluminumBoard
thickness0.4mm-4mmMax.finished board side1020mm*1000mmMin.drilled
hole size0.25mmMin.line width0.10mm(4mil)Min.line
spaceing0.10mm(4mil)Surface finish/treatmentHASL/HASL lead
free,Chemical tin,Chemical Gold,Immersion gold Inmersion
Silver/Gold,Osp,Gold PlatingCopper thickness1/2OZ 1OZ 2OZ 3OZSolder
mask colorgreen/black/white/red/blue/yellowInner packingVacuum
packing,Plastic bagOuter packingStandard carton packingHole
tolerancePTH:±0.076,NTPH:±0.05CertificateISO9001,ISO14001,ROHS,CQCProfiling
PunchingRouting,V-CUT, BevelingAssembly ServiceProviding OEM
service to all sorts of printed circuit board assembly
Technical RequirementProfessional
Surface-mounting and Through-hole soldering TechnologyVarious sizes
like 1206,0805,0603 components SMT technologyICT(In Circuit
Test),FCT(Functional Circuit Test) technologyPCBA Assembly With
CE,FCC,Rohs ApprovalNitrogen gas reflow soldering technology for
SMTHigh Standard SMT&Solder Assembly LineHigh density
interconnected board placement technology capacity
Quote&Production RequirementGerber File or PCBA
File for Bare PCBA Board FabricationBom(Bill of Material) for
Assembly,PNP(Pick and Place file) and Components Position also
needed in assemblyTo reduce the quote time, please provide us the
full part number for each components,Quantity per board also the
quantity fororders.Testing Guide&Function Testing method to
ensure the quality to reach nearly 0% scrap rate
OEM/ODM/EMS ServicesPCBA,
PCBAAassembly: SMT & PTH & BGAPCBA and enclosure designComponents
sourcing and purchasingQuick prototypingPlastic injection
moldingMetal sheet stampingFinal assemblyTest: AOI, In-Circuit Test
(ICT), Functional Test (FCT)Custom clearance for material importing
and product exporting Other PCBA Assembly
EquipmentSMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE
S20/F4Reflow Oven: FolunGwin FL-RX860Wave Soldering Machine:
FolunGwin ADS300Automated Optical Inspection (AOI): Aleader
ALD-H-350B,X-RAY Testing ServiceFully Automatic SMT Stencil
Printer: FolunGwin Win-5Product Parameters(As your customized
products)PCB capabilities:-1500mm long board PCB (FR4 and
aluminium)- FR4, 1 to 49 layer PCB either with HDI.- 2 layer
aluminium PCB- Quick turn: 2L with 24 hours, 4L with 48 hours, 6L
with 72 hours, 8L with 96 hours- No min. order quantity, even 1
piece is workable. PCBA capabilities:-Components
sourcing-SMT & DIP assembly including BGA assembly-Accepted SMD
chips: 01005, BGA, QFP, QFN, TSOP-Component height: 0.2-25 mm-Min
packing: 0201-Min distance among BGA: 0.25-2.0 mm-Min BGA size:
0.1-0.63 mm-Min QFP space: 0.35mm-Pick-placement precision: ±0.01
mm-Placement capability: 0805, 0603, 0402, 0201-High pin count
press fit available-SMT capacity per day: 7,000,000
point Our
Certificates(ISO9001/ISO14001/CE/ROHS...) Packaging
&Shipping(safe and economic)Our company is not only trying to
give customers a good product but also pay attention to offering a
complete and safe package. And here we prepare some personalized
services for all the orders,your requirements also be accepted.
Common packaging: PCB: Vacuum packaging with carton
boxPCBA:ESD packaging with carton box Shipping:
1.Confirming your shipping address is correct be
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