Professional OEM Electronic Manufacturer PCB Design Assembly PCBA

Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm) Max. Board size2000×610mm Min. board Thickness2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space0.1mm(4mil) Max. Copper thickness10OZ Min. S/M Pitch0.1mm(4mil) Min. hole size0.2mm(8mil) Hole dia. Tolerance (PTH)±0.05mm(2mil) Hole dia. Tolerance,+0/-0.05mm(2mil) Hole position deviation±0.05mm(2mil) Outline tolerance±0.10mm(4mil) Twist & Bent0.75% Insulation Resistance>10 12 Ω Normal Electric strength>1.3kv/mm S/M abrasion>6H Thermal stress288°C 10Sec Test Voltage50-300V Min. blind/buried via0.15mm (6mil) Surface FinishedHASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 oz Outer copper thickness0.5~6 oz Finished board thickness0.4-3.2 mm Board thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidation Layer count Capability1-30 LAYER alignment between ML±2mil Min drilling0.15 mm Min finished hole0.1 mm   /* January 22, 2024 19:08:37 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1