PCB ParametersItemPCB ParametersMaterialFR4 (140Tg, 170Tg, 180Tg),
FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers
4350B/3003/4003C/5880, Taconic, Teflon, etcMaterial BrandsKB, ITEQ,
SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA,
Panasonic, Taconic, or other laminate on customer's requestLayer
Count1-40FlammailityUL 94V-0Thermal Conductivity0.3W-300W/mkQuality
StandardsIPC Classes 2/3HDI Build-upAny Layer, up to 3+N+3Board
Thickness0.2~7mmMin Thickness2-layer: 0.2mm4-layer: 0.4mm6-layer:
0.6mm8-layer: 0.8mm10-layer: 1mmMore than 10 layers: 0.5*Layer
Count*0.2mmCopper Thickness0.5-20ozInksSuper White
Inks/Solar/Carbon InksSolder Mask Thickness0.2mil-1.6milSurface
FinishesBare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers,
OSP, IAg, ISn, etcPlating ThicknessHASL:Copper Thickness: 20-35um
Tin: 5-20 umImmersion Gold:Nickel: 100u"-200u" Gold: 2u" -4u"Hard
Plated Gold:Nickel: 100u"-200u" Gold: 4u"-8u"Golden Finger:Nickel:
100u"-200u" Gold: 5u"-15u"Immersion Silver: 6u"-12u"OSP: Film
8u"-20u"Min Hole Size0.15mmMin Trace Width/Spacing2mil/2milVia
Plugging0.2~0.8mmLine Width/Space Tolerance±10%Board Thickness
Tolerance±5%Hole Diameter Tolerance±0.05mmHole Location
Tolerance±2milLayer to Layer Registration2milS/M
Registration1milAspect Ratio10:01Blind Vias Aspect Ratio1:01Outline
Tolerance±0.1mmV- CUT Tolerance±10miBevel Edge± 5milWarp and
Twist≤0.50% (max cap)Quality TestAOI, 100% E-testValue-Added
ServicesDFM Check, Expedited ProductionFeatured
ProcessesBonding, Impedance Control, Via in Pad, Press Fit Hole,
Countersink/Counterbore Hole, Castellated Vias, Edge Plating,
Peelable Solder Mask, Resin Plugged, Plating FlatData
FormatsGerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc PCBA
AbilitiesItemPCBA AbilitiesTurnkey Service PCB Design + PCB
FAB + Components Sourcing + PCB Assembly + Package Value-Added
ServicesBOM Analysis, Conformal Coating, IC Programming, Wire
Harness & Cable Assembly, Box Building Assembly Details 5
SMT + 2 DIP (Dust and anti-static lines) Assembly AbilitiesSMT
5 million points per dayDIP 10 thousands pieces per
day Technical Support Free DFM/A check, BOM
analysis Handing Standards IPC-A-600H, IPC-A-610F,
J-STD-001FMOQ 1 piece Inspection & Testing Visual
Inspection, AOI, SPI, X-ray inspection. First article inspection
for each process. IQC + IPQC + FQC + OQC Inspection
Flow Flying probe test/In-circuit test/Function test/Burn-in
test Files We Need PCB: Gerber (CAM, PCB,
PCBDOC) Components: Bill of Material (BOM list) Assembly:
Pick-and-Place file Functional test: Test Guide PCB Panel
Size Min: 0.25×0.25 inches (6×6mm) Max: 20×20 inches
(500×500mm) PCB Solder Type Water soluble solder paste,
RoHS lead-freePCB Assemble MethodsSMT, THT & Hybrid, single or
double side placement, Part removal and
replacement. Components Details Passive down to 0201
(01005) size Press fit
connectors QFP/BGA/LGA/QFN/COB/COF CSP/WLCSP/POP Fine
Pitch High Pin Count Connectors BGA repair and
reball Lead Time Prototype: 5-15 working days; Mass
production: 20~25 working days. The fastest delivery time is 3
days. Packaging Anti-Static Bags/Customized
Packaging One-Stop OEM PCB Assembly Professional Turnkey
PCBA COMPANY PROFILESPinsheng Electronics started to provide
contract electronics design and manufacturing services in 2008, we
are obsessed with providing the happiest manufacturing experience
to our customers.When our founders found it difficult to get
technical support and always high-quality products from the
manufacturers, they sprouted the vision to provide blissful
electronics manufacturing services to others, they rented an old
workshop and started the journey.In over 15 years, with the same
vision, we have designed, manufactured, and delivered 5,000+
projects for over 2,000 SMEs. The products are alive to us, not
lifeless pieces of stuff.Main CustomersProcessCasesUnderwater
Lighting·High thermal conductivity·Thermoelectric separation·0.15mm
Inner core·Micro bump etching·0.1mm Between FR4 and
copperIndustrial BMS·4-Layer PCB·6OZ Inner layer copper·Edge
plating·High current designEV Charger PileTurnkey PCB assembly for
control board of EV charger pile.Medical Equipment·Large area of
ENIG·Custom red soldermask·6-Layer rigid-flex boardCommunication
Equipment·6-Layer rigid-flex board·10% Differential
impedance·Ventec PPV447·ShengYi FR4·DuPont laminatedPCB
Showcase PCBA Showcase SMT & DIP WorkshopQuality And
Policy:Continually improve our quality, efficiency, service to satisfy thecustomer's requirement.Quality
System:1. ISO-9001:2018 Quality System Standard2. ISO14001
Environment System Standard3. Quality Standard: IPC-610-D class
2,4. Soldering Standard: J-STD-001 class 1,2,35. ESD Standard:
ESD-MIL-STD-16866. Workshop management:5S7. FAI-first article
inspection 8. In process visual inspection9. AOI inspection10.
X-ray Inspection11. SPI Inspection12. Machine calibration and
preventative maintenance13. ERP material and process management (
ERP=enterprise resource planning compute
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