HTGD (brand: GDK) New SMT Full Automatic Solder Paste (Screen
Printer)MX PLUS With High Speed For Circult Board Production
Overview:MX PLUS automatic solder paste printer is a product aimed
at the-high-end application of SMT, especially for precision boards
of 01005 or below, it has better molding and soldering volume. It
can be placed back to back or used by a single machine. Printing
range is 510mmx510mm.With CE Certificate/ Award Certificate/
Software work Certificate/ Software ework Certificat/ Certificate
of Authorization.Technical Parameters:
PCB boarding Handling ParamaterMax. board Size(X x Y)510mm x 510mmMin. board Size(X x Y)50mm x 50mmPCB thickness Range0.4mm~6mmPCB Warpage≤1%DiagonalMax. board weight3KgPCB edge clearanceConfiguration to 3mmPCB bottom clearance20mmConveyor speed (Max.)1500mm/s(Max)Conveyor height 900±40mmConveyor directionL-R,R-L,L-L,R-RTransfer modeOne stage ConveyorPCB Clamping methodAutomatic adjustment of PCB thickness + Programmable elastic side clamp (Option:1.Edge locking base plate pressing;2.Bottom integral cavity vacuum;3.Bottom multi-point local vacuum)Support methodMagnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture)Printing parametersPrinting
headFloating intelligent printing head (two independent
direct connected
motors)Stencil frame size470mm x 370mm~737 mm x 737 mmMax. printing area(X x Y)510mm x 510mmSqueegee Material/AngleSteel squeegee/ Rubber squeegee(Angel 45°/50°/60° matching the printing process)Squeegee length300mm+520mm(optional with length of 200mm-550mm)Squeegee height65±1mmSqueegee thickness0.25mm Diamond-like carbon coatingPrint modeSingle or dual squeegee printingDemoulding
length0.02 mm - 12 mmPrint speed0 ~ 200 mm/sPrint pressure0.5kg - 10KgPrint stroke±275 mm(From the center)Cleaning parametersCleaning system1.Programmable washer fluid injection system; 2. Dry, wet and vacuum modes Length of cleaning and wiping board380mm+500mm(optional with 300mm, 450mm)Optical SystemField of view8mm x 6mmPrinting table adjustment rangeX:±5.0mm,Y:±7.0mm,θ:±2.0°Fiducial TypesStandard Fiducial type(Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openingsVision methodologyIndependent camera,upwards/downwards imaging vision system,geometric matching location Performance parametersMachine Alignment repeatability ±10.0μm @6 σ,Cpk ≥ 2.0Full process repeatability±15.0μm @6 σ,Cpk ≥ 2.0Core Cycle time7.5s(Exclude printing and cleaning)Product Changeover Time
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