ODM/ OEM Factory Game Controller Bluetooth Wireless Game Controller

Basic Info.Model NO.Game ControllerCompatible PlatformNintendo SwitchTypeGamepadTrademarkKCTransport PackageColor BoxSpecification25*12*8CMOrigin Shenzhen HS Code8534001000Product DescriptionProduct Description  game controller   Bluetooth Wireless Game Controller PCB capabilityItemsMass productionMass productionPrototypeLayers32L6L40LBoard typeRigid PCBFPCRigid&flexHDI Stackup4+n+4N/AAny layerMax. Board Thickness10mm(394mil)0.30mm14mm(551mil)Min. WidthInner  Layer2.2mil/2.2mil2.0mil/2.0milOuter Layer2.5/2.5mil2.2/2.2milRegistrationSame  Core±25um±20umLayer to Layer±5mil±4milMax. Copper Thickness6oz12ozMin. Drill Hole DlameterMechanical≥0.15mm(6mil)≥0.1mm(4mil)Laser0.1mm(4mil)0.050mm(2mil)Max. Size (Finish Size)Line-card850mm*570mm1000mm*600mmBackplane1250mm*570mm1320mm*600mmAspect Ratio (Finish Hole)Line-card14:118:1Backplane16:128:1MaterialFR4EM827, 370HR, S1000-2, IT180A, EM825, IT158,  S1000 / S1155, R1566W, EM285, TU862HFHigh SpeedMegtron6, Megtron4, Megtron7,TU872SLK,  FR408HR,N4000-13 Series,MW4000,MW2000,TU933High FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835,  CLTE, Genclad, RF35, FastRise27OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega  , ZBC2000,Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion  Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIGPCBA capabilityProcessItemMass production capabilitySMTPrintingMax PCB size900*600mm²Max PCB weight8kgSolder paste printing tolerance±25μm(6σ)System repeat calibration tolerance±10μm(6σ)Scraper pressure detectionpressure closed-loop control system SPIDetect Min BGA PAD to PAD distance100μmx-axis and  Y-axis tolerance0.5μmFalse Rate ≤0.1%Mount Component size0.3*0.15 mm²--200*125 mm²Component max height25.4mmPopulate Max component weight100gBGA/CSP Min PAD spacing, and Min  PAD diameter0.30mm,0.15mmPopulate tolerance±22μm(3σ),±0.05°(3σ)PCB board size 50*50 mm²-850*560 mm²PCB thickness0.3mm--6mmMax PCB weight6kgPopulate Max components type500AOIDetect Min components01005Detect false typeIncorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ballFoot warping detection3D Detection functionReflowTemperature Accuracy±1ºCWelding protectionnitrogen protection;(remaining oxygen4096Test contentContact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.Assembly and testProduction typeTouchPadMass productionTWSMass productionBaby CameraMass productionGaming controllerMass productionLife WatchMass productionFT testtest levelPCB board system level test.Test System function status.Temperature cycling testTemperature range-60ºC--125ºCRise/lower temperature rate>10ºC/minTemperature tolerance≤2ºCOther Reliability testburn-in test,Drop test, vibration test , Abrasion test ,Key life test.                                                      Company Profile