Specifications: Multi functional universal chip mounter H 806 plus
Advantage description: - Multi camera CMDS high speed imaging
technology based on FPGA, with multiple sensors taking pictures in
full synchronization - Real time image acquisitio with high
frame rate and megapixel resolution - Complete accurate visual
identification of various standard and special-shaped parts - The
chip head adopts small volume, ultra quiet linear motor control
technology Specification product feature Application
industry: SMT electronic material patch, 3C,Aerospace,
automotive electronics, home appliances, lighting, 3C consumer
electronics, semiconductor To realize multi-functional full-image
high speed and high precision mounting, its high speed and high
efficiency to cope with small components (01005, 0201-3216, micro
transistor), at the same time can meet the range of medium and
large components (SOP, QFP, BGA) multi-function mounting
localization rate of parts and components:95% Product function •01
Identification of various complex components •02 High precision
visual recognition system •03 Real-time flying camera filming
technology •04 Simple and easy to operate interface •05 Ultra quiet
linear motor control technology Product brief introduction Product
sample type: Mounting example Precision device Technical
specifications: •Positioning mode: flying vision + stage vision
•Number of Spindles : •1 arm * 8 nozzles (Spacing 21mm) •Pick and
place accuracy: XY accuracy: •±0.035mm •Pick and place speed
:CPH:18000 •Component Range:01005~40*35,H:15mm
SOP,QFP,BGA etc, •PCB Dimension:
Minimum:length(50mm)*width(50mm), H:0~5mm Maximum: standard
length(600mm)* width(500mm), H:0~5mm •Feeder Base: 8mm
-120 pcs •Power supply / Pressure:380/50Hz/0.5~0.7Mpa •Rated
Power:6.5KW •Machine weight:1800Kg
•Dimension:1950(L)*1400(W)*1370(H); adding the ground anchor
(H): 1500mm Product feature •accurate •stable •efficient
•convenient and fast /* March 10, 2023 17:59:20
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