Product DescriptionThe DU9721 Series of die bonders is a
high-speed machine designed for multi-chip packaging. With
self-developed motion control technology, it achieves
high-precision die bonding with an accuracy of ±7@3σ microns and
can achieve an ultimate bonding efficiency of up to 7000 pieces per
hour (depending on the process). The DU9721 series adopts an open
architecture and modular design, providing customers with on-demand
customization capabilities for maximum efficiency. It integrates
various functional modulessuch as dispensing, automatic tool
changing, and hot-press bonding, and can handle multiple wafer
sizes and substrate transfer methods to meet various packaging
technologies, including die bonding, MCM, flip chip, SiP,
etc.Detailed PhotosUltimate Efficiency: Meets high-precision die
bonding accuracy of ±7 microns @ 3σ and achieves an ultimate
bonding efficiency of up to 12,000 pieces per hour (depending on
the process).Multi-functionality: Die bonder, flip chip bonder, and
multi-chip packaging in one machine.Flexibility: Supports wafer,
waffle pack, gel pack, and feeder feeding; Supports die bonding on
substrate, boat, carrier, PCB, leadframe, and wafer; Supports
epoxy, soldering, and hot-press bonding; Supports packaging
technologies including Die attach, MCM, Flip chip, and
SiP.Customizable: Modular design combined with standardized
platform design concept, releasing a new product line every 6
months; compatible with different categories of development needs,
supports multiple feeding methods, and can be customized production
lines according to customer requirements. Product
ParametersProduct modelDU9721X/Y Placement Accuracy± 7µm @ 3σTheta
Placement Accuracy±0.15°@ 3σBonding Head HeatingTemperatureUp to
350 °C (optional)Binding force10~7,500 g (programmable)Rotation
range0°- 360° rotationWafer size4" - 12" (100mm -
300mm)DieSize(Bonded)Die Attach: 5mm,5mm - 50mmDie Size
(Flip-Chip)Flip Chip: 0.5mm - 5mm,5mm-50mmDie Thickness0.05mm -
7mmFrame Size5" - 15" (125mm - 375mm)Wafer CarrierWaffle pack /
Gel-Pak® 2"×2" and 4"×4"/JEDEC traySubstrate typeFR4, ceramic, BGA,
flex, boat, lead frame, waffle pack,Gel-Pak®,JEDEC tray, odd-shape
substratesSubstrate range13"× 8"(325mm× 200mm)UPH7000(max)Equipment
Dimensions1,160mm×1,225mm×1,800mm After Sales ServiceCompany
ProfileSuzhou BOZHON Semiconductor Co., Ltd. was established in
2022 and is a global semiconductor equipment R&D and
manufacturing company. With over 20 years of technical expertise in
the semiconductor industry, the company provides leading and stable
advanced process and inspection equipment to its customers. Suzhou
BOZHON Semiconductor is committed to becoming a leader in the
Chinese semiconductor industry by developing and innovating
products using micrometer, sub-micrometer, and nanometer-level
technologies. The company aims to promote the advancement of
semiconductor processes and industry upgrades, and continuously
provide cutting-edge products to the industry.
FAQ1.Where does Bozhon Semiconductor come from?Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.
2.Are the products self-branded or resold?All products are self-developed, and many technologies have been awarded national patents.
3.What is the minimum order quantity for the product?1 set.
4.How long does it take to ship an order?Within 100 days of signing the contract
5.Is the price on the product page the final price?No, the final price is based on the specific product model, subject to the actual offer.
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