Advanced Packaging Technologies Epoxy Die Attach Machine with High Customizable

  Product DescriptionThe DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up to 7000 pieces per hour (depending on the process). The DU9721 series adopts an open architecture and modular design, providing customers with on-demand customization capabilities for maximum efficiency. It integrates various functional modulessuch as dispensing, automatic tool changing, and hot-press bonding, and can handle multiple wafer sizes and substrate transfer methods to meet various packaging technologies, including die bonding, MCM, flip chip, SiP, etc.Detailed PhotosUltimate Efficiency: Meets high-precision die bonding accuracy of ±7 microns @ 3σ and achieves an ultimate bonding efficiency of up to 12,000 pieces per hour (depending on the process).Multi-functionality: Die bonder, flip chip bonder, and multi-chip packaging in one machine.Flexibility: Supports wafer, waffle pack, gel pack, and feeder feeding; Supports die bonding on substrate, boat, carrier, PCB, leadframe, and wafer; Supports epoxy, soldering, and hot-press bonding; Supports packaging technologies including Die attach, MCM, Flip chip, and SiP.Customizable: Modular design combined with standardized platform design concept, releasing a new product line every 6 months; compatible with different categories of development needs, supports multiple feeding methods, and can be customized production lines according to customer requirements.  Product ParametersProduct modelDU9721X/Y Placement Accuracy± 7µm @ 3σTheta Placement Accuracy±0.15°@ 3σBonding Head HeatingTemperatureUp to 350 °C (optional)Binding force10~7,500 g (programmable)Rotation range0°- 360° rotationWafer size4" - 12" (100mm - 300mm)DieSize(Bonded)Die Attach: 5mm,5mm - 50mmDie Size (Flip-Chip)Flip Chip: 0.5mm - 5mm,5mm-50mmDie Thickness0.05mm - 7mmFrame Size5" - 15" (125mm - 375mm)Wafer CarrierWaffle pack / Gel-Pak® 2"×2" and 4"×4"/JEDEC traySubstrate typeFR4, ceramic, BGA, flex, boat, lead frame, waffle pack,Gel-Pak®,JEDEC tray, odd-shape substratesSubstrate range13"× 8"(325mm× 200mm)UPH7000(max)Equipment Dimensions1,160mm×1,225mm×1,800mm  After Sales ServiceCompany ProfileSuzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.  FAQ1.Where does Bozhon Semiconductor come from?Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group. 2.Are the products self-branded or resold?All products are self-developed, and many technologies have been awarded national patents. 3.What is the minimum order quantity for the product?1 set. 4.How long does it take to ship an order?Within 100 days of signing the contract 5.Is the price on the product page the final price?No, the final price is based on the specific product model, subject to the actual offer.   /* March 10, 2023 17:59:20 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1