Laser Cutting and Routing Systems for The Depaneling of PCB, FPC

                                    Laser Cutting and Routing Systems for The Depaneling of PCB, FPC | Supuerwave ®   Laser Depaneling is the most innovative and promising technique for cutting and separating printed circuit boards from the panel and is differentiated from the classic separation methods in particular by its flexibility and stress-free processing.    Features1. High quality cutting edge of PCB & FPC: The narrow beam diameter of the laser enables precise and high quality processing of the PCB & FPC material.2. Sress-free processing: Due to the non-contact process, Laser separates the printed circuit boards from the panel without any mechanical stress to the material. 3. Keep clean processing: In mechanical processes, such as milling, dust is generated during the manufacturing process, while Laser depaneling evaporates the material, and at the same time, Fume extraction device exhausts the cutting fumes and keep the boards clean. 4. Materials diversity:  Superwave Laser Depaneling can process a wide variery of different substrate materials with ease by varying the process parameters.     Technical Data  Laser modelSW-PCBLaser power10W / 15W / 20WWorking Area200 x 300mm (Customization Accepted)Laser wavelength355±15nmMax diameter of Focus beam20μmRepeatability