High Precision Laser Micro Hole Processing

Laser cutting and technology: Laser cutting is a technique that uses laser beam to interact with materials to precisely cut, surface, punch, scribe, etch, nuclear, and micro-machine materials. Laser processing features: · High precision, high performance and high efficiency · Small photoelectricity, concentrated energy, and less thermal impact · No contact with processed workpieces, no pollution to the price · Fast punching and smooth hole · The laser cutting seam is thin, fast and low in heat. · Round and dense group density. Application range: a) LED chip manufacturing / wafer level chip package b) touch screen of the navigation device c) Semiconductor / Lighting d) LCD/MEMS (pressure sensor, accelerometer...) e) Research / Aviation / Military f) Consumer Electronics Damage Protection Glass g) Life sciences (micro-channels, etc.) h) and many other customer-specific applications   Main technical indicators of glass shape processing | Thickness: >0.1mm | Roundness: ±0.001mm | Collapse: 5mm | Machining accuracy: ±0.01mm | Cutting, punching hours: 5mm / s | Dimensional tolerance: ±0.003mm | Minimum processing aperture: Φ0.1mm /* March 10, 2023 17:59:20 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1